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Quality Engineer
Ref No.: 18-24932
Location: San Diego, California
Job Overview:
The team is seeking an experienced microelectronic assembly quality engineer who has worked with various packaging technologies, including flipchip, wirebond, WLP, PoP, compression molding, and transfer molding. The role is responsible for development and qualification of SiP assembly processes and equipment, and establish SiP process control and quality control plan, and provide/document the required procedures. Supplier quality experience and quality failure capability experience are also preferred.
Minimum Qualifications:
Minimum of 3 years of hands-on experience in 1 or more of the following areas: Microelectronic assembly processes for consumer products. Manufacturing process experience in SIP modules, wirebond, flip chip, underill, compression molding, transfer molding, and other packaging assembly technologies. IPC workmanship and performance standards related to electronic assemblies (IPC-610, JEDEC stds etc.).
Preferred Qualifications:
Experience in 1 or more of the following areas in preferred: Working experience in SiP assembly or OSAT. Familiarity with quality methodologies, such as Six Sigma, probability, statistics, sampling, DOE, capability studies. SMT Manufacturing processes. Strong communication skills including the ability to deliver effective presentations to peers, management and customers and good documentation skills for the quality control plan Supplier quality experience is preferred. Strong quality experience on modules production and SMT production is preferred. Strong procedure documentation capability, strong failure analysis capability, strong Excel, data crunching and analysis capability are preferred.
Education:
Bachelor's Engineering degree or higher on material science, or mechanical engineering,